Our resource library is host to an extensive collection of knowledge. Here you will find technical papers, white papers, case studies and presentations on our technology and its uses within a fab.
Learn how we applied multi-objective optimization to the diffusion area at Renesas Electronics to manage three conflicting KPIs.
Learn how applying multi-objective optimization helped to increase throughput whilst reducing reticle moves and queue time.
Recap on the first of two presentations from SEMICON Europa 2022 – featuring case study results from three different wafer fabs, including Renesas and Seagate.
Gain a comprehensive understanding of where we came from, what we do, and why we’re different with our company introduction.
Our white paper details a new approach to wafer fab scheduling. A novel hybrid model that delivers optimized schedules in a matter of minutes to help fabs cut costs and increase efficiency.
This technical paper provides a comprehensive overview of results from benchmark studies performed for Seagate Technology, where our solution was applied to metrology toolset scheduling.
Discover how we helped a highly-utilised Seagate Technology wafer fab reduce cycle time and boost efficiency by applying our next-generation production scheduling solution.
Flexciton optimizes scheduling to provide much greater performance than standard dispatching methods. Typically, dispatch systems use a rule-based approach to make decisions at a tool. When implemented, our software uses hybrid-optimization technology to calculate schedules and send them to your dispatch system for execution.
Since Flexciton software understands the current fab state across multiple toolsets, it optimizes decisions accordingly. It has the ability to adapt to an ever-changing fab environment, with no need to update the algorithms, even when significant changes occur within the system.
Flexciton engineers have developed a hybrid-optimization technology, making our scheduling solution unique across the industry. It offers superior performance compared to broadly used heuristic or rules-based algorithms. For more details about our technology and solution, please download our white paper.
We offer a number of different ways to experience our solution at no cost, before expecting you to make any formal commitments:
Our software can be easily integrated with your existing MES, as well as your local dispatch system to execute schedules. In particular, Flexciton requires ‘moves’ data from your MES, maintenance data (CMMS) as well as top-level planning data, such as due dates or priorities. Additionally, we model some constraints using configuration files (where the format of these files are provided).
Flexciton can be configured to model many of the common fab constraints, ranging from changeover sequencing for Implanters, through to reticle scheduling for Photolithography. However, if you have unique tool constraints - we can build these in for you.
Once implemented, Flexciton’s scheduler works behind the scenes to keep the factory fed with optimal schedules every few minutes. Specific users can access the Flexciton web application to view the Gantt chart, generate alternative scheduling scenarios and change the optimization weights/parameters. Request a demo to learn more.
Flexciton favours cloud deployment and it is the most common deployment choice for our clients. However, on-premise is also an option if required. Get in touch with us for more information.
This term refers to the management of processes involved in the optimization of raw materials and resource capacity within a wafer fab or factory.
An optimization term that describes a piece of software that will make decisions and/or take actions in its environment in order to achieve a given goal.
A wafer batch, also known as a wafer lot, is a group of wafers that are processed together, at the same time.
A bottleneck refers to a tool that is limiting the production capacity of a fab. This is usually caused by more wafers arriving at the tool than it can process, causing a build up of queuing WIP.
Capacity refers to the maximum level of output of wafers a manufacturer can achieve over a period of time.
Cycle time is the total amount of time taken to complete the manufacturing, from start to finish, of a single unit i.e., one wafer.
A system, often referred to as real-time dispatch (RTD), that is used by chip manufacturers to dispatch wafers onto tools using basic heuristic rules such as “first in, first out”.
In wafer fabrication, etching refers to any technology that will selectively remove material from a thin film on a substrate (with or without prior structures on its surface) and by this removal create a pattern of that material on the substrate.
Semiconductor processing facility which turns silicon wafers into integrated circuits.
Furnaces, also known as diffusion furnaces, are heated tubular spaces used in the manufacturing process of semiconductors. They are used to add doping impurities into high purity silicon wafers, thereby creating embedded semiconductor devices.
Global scheduling is a capability of Flexciton’s advanced scheduler whereby the optimizer is able to take into consideration the entirety of the fab – such as the state of toolsets further down the production line.
A heuristic is any approach to problem-solving that uses a practical method or various shortcuts in order to produce solutions that may not be optimal but are sufficient given a limited timeframe or deadline.
A unique model based on mixed-integer linear programming (MILP), using a unique combination of mathematical optimization, heuristic search and smart decomposition methods.
Implantation, or ion implantation, is a low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the physical, chemical, or electrical properties of the target.
The use and development of computer systems that are able to learn and adapt without following explicit instructions, by using algorithms and statistical models to analyse and draw inferences from patterns in data.
Commonly referred to as MES, manufacturing execution systems serve as the intermediary between a business system and a manufacturer's plant floor control equipment.
Metrology is the science of measuring and characterising tiny structures and materials, and there are a number of tools and technologies within this category.
Mixed-integer linear programming (MILP) is the state-of-the-art mathematical framework for the optimization of processes and systems.
The action of making the best or most effective use of a situation or resource.
On Time Delivery or OTD refers to a key performance indicator measuring the rate of finished product and deliveries made in time.
A photolithography system undertakes a process whereby highly complex circuit patterns from a reticle are reduced using ultra-high-performance lenses and exposed onto a wafer.
Reticles are typically carried around in the factory in containers known as pods. A pod is inserted into a machine, and the machine can use the reticles in the pod.
Preventative maintenance keeps equipment in good condition through regular machinery checkups and maintenance tasks. These services may be scheduled according to a calendar or based on equipment operating time.
The amount of time a batch of wafers spends waiting at a tool before it can be processed.
A reticle, also known as a photomask, is a plate of optical glass with an opaque pattern on it, used in photolithography. When laser light is shone through the reticle, a pattern of light and dark is projected onto the silicon wafer.
A rule-based system is a system that applies human-made rules to store, sort and manipulate data. In doing so, it mimics human intelligence.
Scheduling is the process of arranging, controlling and optimizing work and workloads in a production process or manufacturing process.
Reticles are stored in a central magazine called a Stocker. An engineer inserts a pod into the stocker, and the stocker robotically opens the pod, removes some reticles and replaces them with different ones.
The next-generation of manufacturing that employs computer-integrated systems, high levels of adaptability and rapid design changes, digital information technology, and more flexible technical workforce training.
Throughput is the amount of wafers that a company can produce and deliver to a client within a specified period of time. The term is often used in the context of a company's rate of production or the speed at which something is processed.
A timelink (also known as time constraints, time lag constraints, time loops or close coupling constraints) is a maximum amount of time that can elapse between two or more consecutive manufacturing process steps of a batch of wafers.
A group of tools which can run the same recipes.
A wafer is a thin disc of silicon (one of the most abundant semiconductors available worldwide) or another semiconductor material, used as the basis for creating electronic integrated circuits.
The importance placed on a batch of wafers that helps to determine which should be prioritised in order to benefit the objectives of the fab.
Wafers travel along a defined route through the fab, and that route is made up of multiple steps. Generally speaking, each step is one process in one tool using one recipe.
WIP stands for Work In Progress and refers to wafers that have entered the production process but are not yet a finished product.
Yield is a quantitative measure of the quality of a semiconductor process. It is the fraction of dies on the yielding wafers that are not discarded during the manufacturing process.